Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols.
无论是标记还是切割晶片，激光器都会为半导体制造带来明显的优势和成本节省。在标记从空白硅晶片到完整的包装设备的所有内容方面，必须进行非接触和低分化过程。
CMS Laser’s wafer processing systems offer a wide range of solutions including serialization for traceability, scribing and lapping. Our laser systems can process the full range of semiconductor substrates and coatings—include silicon, sapphire, lithium tantalate, silicon carbide, III-V semiconductors, II-VI semiconductors, and photo resists.
Our engineers understand the nuances of wafer handling, throughput and clean room requirements. They have experience with a wide variety of substrate types—silicon, sapphire, GaAS, InP, SiGe and more.
We can tailor turnkey laser systems to your application requirements, accounting for geometric, dimensional, line width and slag tolerances.
